When making alloy resistor patches, the removal of the adhesive cannot be solely based on whether the adhesive has been removed. More importantly, will the resistance drift after removing the adhesive? Will the substrate be scratched? Can the yield rate stabilize?
Traditional scraping and chemical cleaning often rely on manual experience, with large batch differences and difficult control of residual glue and substrate damage risks. Many factories have tried various methods of removing adhesive, and finally found that either the substrate is damaged or the residual adhesive cannot be removed completely, resulting in a consistently poor yield rate.
The CKD laser debonding machine adopts non-contact precision laser processing. By precisely controlling the laser energy and scanning path, it achieves selective removal of the adhesive layer, only removing the adhesive without damaging the resistor body.
The actual testing and sampling results are intuitively visible:
Clean removal of adhesive layer: no residual adhesive or carbonization on the surface, neat edges without burrs.
Zero damage to the substrate: The laser accurately acts on the adhesive layer, and the resistor body is scratch free and has no thermal impact.
Stable resistance: After removing the adhesive, there is no drift in resistance, meeting customer quality requirements.
High consistency: Stable batch processing results with small batch differences.
The equipment supports automatic loading and unloading, CCD visual positioning, reducing manual intervention and improving production line efficiency. The entire process is solvent-free, the site is cleaner, and meets the requirements of green manufacturing.
